Evolution of Lithography and Development Status of EUV Lithography

EUV Lithography—The Successor to Optical Lithography?

This paper discusses the basic concepts and current state of development of EUV lithography (EUVL), a relatively new form of lithography that uses extreme ultraviolet (EUV) radiation with a wavelength in the range of 10 to 14 nanometer (nm) to carry out projection imaging. Currently, and for the last several decades, optical projection lithography has been the lithographic technique used in the...

Approach to EUV Lithography Simulation

Longer Wavelength EUV Lithography (LW-EUVL)

Extreme UV Lithography (EUVL) is generally accepted as the leading candidate for next generation lithography. Several challenges remain for EUVL, especially as its insertion point is pushed to finer resolution. Although diffractive scaling may suggest a transition to shorter EUVL wavelengths, several issues arise that would make that difficult. Challenges involve issues such as flare, multilaye...

Modeling and optimization of mass-limited targets for EUV Lithography

Current challenges in the development of efficient laser produced plasma (LPP) sources for EUV lithography are increasing EUV power at IF and maximizing lifetime and therefore, reducing cost of devices. Mass-limited targets such as small tin droplets are considered among the best choices for cleaner operation of the optical system because of lower mass of atomic debris produced by the laser bea...

Important processes in modeling and optimization of EUV lithography sources

Laser produced plasma (LPP) sources for extreme ultraviolet (EUV) photons are currently based on using small liquid tin droplets as target that has advantages in generation of stable continuous targets at high repetition rate, larger photon collection angle, and reduced contamination and damage to optical mirror system from plasma debris and energetic particles. The ideal target is to generate ...